Group dynamics: Dongfeng's first batch of independent silicon carbide power modules are offline

November 1, 2023
Latest company news about Group dynamics: Dongfeng's first batch of independent silicon carbide power modules are offline

Recently, the first batch of silicon carbide modules using nanosilver sintering technology were successfully taken off the production line of Zhixin Semiconductor Phase II, completing independent packaging, testing, and application aging tests. This will bring great benefits to the development of China's new energy vehicle industry.


Silicon carbide wide bandgap semiconductor is a key research project in the forefront of science and technology in the national "14th Five Year Plan" outline. With its excellent high bandgap width, high electron mobility, high thermal conductivity, and other characteristics, silicon carbide modules have significant advantages of high efficiency, high pressure, and high working temperature, and their application in mid to high-end new energy vehicles is becoming increasingly popular.


latest company news about Group dynamics: Dongfeng's first batch of independent silicon carbide power modules are offline  0


The Zhixin Semiconductor Silicon Carbide Module project is based on the new generation 800V high-voltage platform of Dongfeng's independent brand "Mach Power". The project was initially developed in 2021 and officially approved as a mass production project in December 2022. The silicon carbide module project is led by Zhixin semiconductor packaging technology and extensively cooperates with central enterprises and universities, achieving independent control of key core technologies from module design, module packaging testing, electronic control application to vehicle road testing and other aspects. At present, the silicon carbide module development project has participated in one special project of the State owned Assets Supervision and Administration Commission and two industry standard formulation projects.


The silicon carbide module adopts nano silver sintering process and copper bonding technology, uses high-performance silicon nitride ceramic lining plate and customized pin fin heat dissipation copper substrate. The thermal resistance is improved by more than 10% compared to traditional processes, the working temperature can reach 175 ℃, the loss is significantly reduced by more than 40% compared to IGBT modules, and the vehicle range is increased by 5% -8%.


The development and application of this product will undoubtedly bring huge core competitiveness to Dongfeng Group's new energy vehicles, putting Dongfeng and Junfeng's core technologies of new energy vehicles in a leading position.